6 March 2014 Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration
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Proceedings Volume 8970, Laser 3D Manufacturing; 897008 (2014) https://doi.org/10.1117/12.2044327
Event: SPIE LASE, 2014, San Francisco, California, United States
Abstract
Photonic wire bonding exploits three-dimensional (3D) two-photon lithography to fabricate single-mode connections between nanophotonic circuits that are located on different chips. The shape of the photonic wire bonds can be adjusted to the positions of the chips such that high-precision alignment becomes obsolete. The technique enables photonic multi-chip modules that combine the strengths of different optical integration platforms.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. Koos, C. Koos, W. Freude, W. Freude, N. Lindenmann, N. Lindenmann, S. Koeber, S. Koeber, T. Hoose, T. Hoose, M. R. Billah, M. R. Billah, } "Three-dimensional two-photon lithography: an enabling technology for photonic wire bonding and multi-chip integration", Proc. SPIE 8970, Laser 3D Manufacturing, 897008 (6 March 2014); doi: 10.1117/12.2044327; https://doi.org/10.1117/12.2044327
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