6 March 2014 Laser nanolithography and chemical metalization for the manufacturing of 3D metallic interconnects
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Proceedings Volume 8970, Laser 3D Manufacturing; 89700C (2014) https://doi.org/10.1117/12.2041168
Event: SPIE LASE, 2014, San Francisco, California, United States
We present a developed method based on direct laser writing (DLW) and chemical metallization (CM) for microfabrication of three-dimensional (3D) metallic structures. Such approach enables manufacturing of free­-form electro conductive interconnects which can be used in integrated electric circuits such micro-opto-electro mechanical systems (MOEMS). The proposed technique employing ultrafast high repetition rate laser enables efficient fabrication of 3D microstructures on dielectric as well as conductive substrates. The produced polymer links out of organic-inorganic composite matrix after CM serve as interconnects of separate metallic contacts, their dimensions are: height 15μm, width 5μm, length 35-45 μm and could provide 300 nΩm resistivity measured in a macroscopic way. This proves the techniques potential for creating integrated 3D electric circuits at microscale.
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Tomas Jonavičius, Tomas Jonavičius, Sima Rekštytė, Sima Rekštytė, Albertas Žukauskas, Albertas Žukauskas, Mangirdas Malinauskas, Mangirdas Malinauskas, "Laser nanolithography and chemical metalization for the manufacturing of 3D metallic interconnects", Proc. SPIE 8970, Laser 3D Manufacturing, 89700C (6 March 2014); doi: 10.1117/12.2041168; https://doi.org/10.1117/12.2041168

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