In this paper we present two vertical transitions, in multilayer LCP substrates for millimeter wave (mmW) imaging application. The first transition is from conductor-backed co-planar waveguide (CBCPW) to strip line, and the second one connects CBCPW to substrate integrated waveguide (SIW). The multilayer structure consists of three LCP layers and four metal claddings. The CBCPW is designed on the top LCP layer, the strip line is sandwiched by the top and middle layers, and the SIW is built within the middle and bottom layers. Micro vias construct the side wall for the SIW, and electrically connect the transmission lines and waveguides. Both of the transitions perform low loss and low reflection at 77 GHz. They can efficiently connect the passive and active components in the front-end RF module of our mmW imager. Additionally, they may have promising application in high-performance systems, requiring high density, low size, weight, and power (SWaP).