8 March 2014 Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology
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Proceedings Volume 8990, Silicon Photonics IX; 899003 (2014) https://doi.org/10.1117/12.2038989
Event: SPIE OPTO, 2014, San Francisco, California, United States
Abstract
Silicon photonics is a rapidly growing R&D field where universities, institutes and companies are all involved and the business expectations for the next few years are high. One of the key enabling elements that led to the present success of silicon photonics is ePIXfab. It is a consortium of institutes that has together offered multi-project wafer (MPW) runs, packaging services, training, and feasibility studies. These services have significantly lowered the barrier of various research groups and companies to start developing silicon photonics. Until now the MPW services have been offered by the ePIXfab partners IMEC, CEA-Leti and IHP, which all use CMOS-type silicon photonics technology with a typical silicon-on-insulator (SOI) waveguide thickness of 220 nm. In November 2013 this MPW offering was expanded by the ePIXfab partner VTT that opened the access to its 3 μm SOI waveguide platform via ePIXfab MPW runs. This technology platform is complementary to the mainstream silicon photonics technology (220 nm) and it offers such benefits as very low losses, small polarization dependency, ultrabroadband operation and low starting costs
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Timo Aalto, Matteo Cherchi, Mikko Harjanne, Sami Ylinen, Markku Kapulainen, Tapani Vehmas, "Launching of multi-project wafer runs in ePIXfab with micron-scale silicon rib waveguide technology", Proc. SPIE 8990, Silicon Photonics IX, 899003 (8 March 2014); doi: 10.1117/12.2038989; https://doi.org/10.1117/12.2038989
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