8 March 2014 The Euler bend: paving the way for high-density integration on micron-scale semiconductor platforms
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Proceedings Volume 8990, Silicon Photonics IX; 899004 (2014) https://doi.org/10.1117/12.2039912
Event: SPIE OPTO, 2014, San Francisco, California, United States
We present our recent breakthrough for high density integration in micron-scale thick semiconductor platforms. The novel bend concept is presented from a theoretical point of view and supported by experimental results on silicon strip waveguides, including the smallest low-loss bends ever reported for an optical waveguide. Some experimental example applications to resonators, spirals, and Mach-Zehnder interferometers are also presented, along with envisaged applications to other semiconductor platforms. A special focus will be dedicated to potential applications in III-V platforms, where the novel bend could lead to unprecedented dense integration of devices as well as to novel concepts for active components.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matteo Cherchi, Matteo Cherchi, Sami Ylinen, Sami Ylinen, Mikko Harjanne, Mikko Harjanne, Markku Kapulainen, Markku Kapulainen, Tapani Vehmas, Tapani Vehmas, Timo Aalto, Timo Aalto, } "The Euler bend: paving the way for high-density integration on micron-scale semiconductor platforms", Proc. SPIE 8990, Silicon Photonics IX, 899004 (8 March 2014); doi: 10.1117/12.2039912; https://doi.org/10.1117/12.2039912


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