8 March 2014 The Euler bend: paving the way for high-density integration on micron-scale semiconductor platforms
Author Affiliations +
Proceedings Volume 8990, Silicon Photonics IX; 899004 (2014) https://doi.org/10.1117/12.2039912
Event: SPIE OPTO, 2014, San Francisco, California, United States
Abstract
We present our recent breakthrough for high density integration in micron-scale thick semiconductor platforms. The novel bend concept is presented from a theoretical point of view and supported by experimental results on silicon strip waveguides, including the smallest low-loss bends ever reported for an optical waveguide. Some experimental example applications to resonators, spirals, and Mach-Zehnder interferometers are also presented, along with envisaged applications to other semiconductor platforms. A special focus will be dedicated to potential applications in III-V platforms, where the novel bend could lead to unprecedented dense integration of devices as well as to novel concepts for active components.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Matteo Cherchi, Matteo Cherchi, Sami Ylinen, Sami Ylinen, Mikko Harjanne, Mikko Harjanne, Markku Kapulainen, Markku Kapulainen, Tapani Vehmas, Tapani Vehmas, Timo Aalto, Timo Aalto, } "The Euler bend: paving the way for high-density integration on micron-scale semiconductor platforms", Proc. SPIE 8990, Silicon Photonics IX, 899004 (8 March 2014); doi: 10.1117/12.2039912; https://doi.org/10.1117/12.2039912
PROCEEDINGS
7 PAGES


SHARE
RELATED CONTENT

Mid-infrared photonics devices in SOI
Proceedings of SPIE (March 14 2013)
Recent advances in silicon photonic integrated circuits
Proceedings of SPIE (February 13 2016)
Fabrication tolerant flat-top interleavers
Proceedings of SPIE (February 20 2017)
Second order add/drop filter with a single ring resonator
Proceedings of SPIE (February 20 2017)

Back to Top