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8 March 2014 A 1.3 Tb/s parallel optics VCSEL link
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Proceedings Volume 8991, Optical Interconnects XIV; 89910C (2014)
Event: SPIE OPTO, 2014, San Francisco, California, United States
A high bandwidth optical interconnect is designed based on parallel optical VCSEL links. Large matrices with 168 data channels are utilized exhibiting the highest reported full duplex aggregate bandwidth of 1.34Tb/s. Optical links of 300m are measured with BER < 10-12 while the power efficiency is 10.2 pJ/bit. The interconnect design is that of hybrid device with the III-V optoelectronics assembled directly onto the ASIC using Au/Sn eutectic bonding. Optical packaging is enabled using fiber bundle matrices whose dimensions are identical to those of the optoelectronic chips. The entire chip is assembled onto a system PCB in telecom and datacom applications. The backplane of the system becomes passive optical backplane and is entirely fiber based. The hybrid integration allows for a 3-fold increase in the number of SerDes available on a single package to about 500 lanes.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kobi Hasharoni, Shuki Benjamin, Amir Geron, Stanislav Stepanov, Gideon Katz, Itai Epstein, Niv Margalit, David Chairman, and Michael Mesh "A 1.3 Tb/s parallel optics VCSEL link", Proc. SPIE 8991, Optical Interconnects XIV, 89910C (8 March 2014);

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