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8 March 2014 Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application
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Proceedings Volume 8991, Optical Interconnects XIV; 89910H (2014)
Event: SPIE OPTO, 2014, San Francisco, California, United States
The future need for more bandwidth forces the development of optical transmission solutions for rack-to-rack, boardto- board and chip-to-chip interconnects. The goals are significant reduction of power consumption, highest density and potential for bandwidth scalability to overcome the limitations of the systems today with mostly copper based interconnects. For system integration the enabling of thin glass as a substrate material for electro-optical components with integrated micro-optics for efficient light coupling to integrated optical waveguides or fibers is becoming important. Our glass based packaging approach merges micro-system packaging and glass integrated optics. This kind of packaging consists of a thin glass substrate with integrated micro lenses providing a platform for photonic component assembly and optical fiber or waveguide interconnection. Thin glass is commercially available in panel and wafer size and characterizes excellent optical and high frequency properties. That makes it perfect for microsystem packaging. A suitable micro lens approach has to be comparable with different commercial glasses and withstand post-processing like soldering. A benefit of using laser ablated Fresnel lenses is the planar integration capability in the substrate for highest integration density. In the paper we introduce our glass based packaging concept and the Fresnel lens design for different scenarios like chip-to-fiber, chip-to-optical-printed-circuit-board coupling. Based on the design the Fresnel lenses were fabricated by using a 157 nm fluorine laser ablation system.
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Lars Brusberg, Marcel Neitz, Henning Schröder, Thomas Fricke-Begemann, and Jürgen Ihlemann "Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application", Proc. SPIE 8991, Optical Interconnects XIV, 89910H (8 March 2014);

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