8 March 2014 Chip-to-chip optical interconnects based on flexible integrated photonics
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Proceedings Volume 8991, Optical Interconnects XIV; 89910T (2014) https://doi.org/10.1117/12.2037812
Event: SPIE OPTO, 2014, San Francisco, California, United States
A high bandwidth density chip-to-chip optical interconnect architecture is analyzed. The interconnect design leverages our recently developed flexible substrate integration technology to circumvent the optical alignment requirement during packaging. Initial experimental results on fabrication and characterization of the flexible photonic platform are also presented.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lan Li, Yi Zou, Hongtao Lin, Juejun Hu, Xiaochen Sun, Ning-Ning Feng, Sylvain Danto, Kathleen Richardson, Tian Gu, Michael Haney, "Chip-to-chip optical interconnects based on flexible integrated photonics", Proc. SPIE 8991, Optical Interconnects XIV, 89910T (8 March 2014); doi: 10.1117/12.2037812; https://doi.org/10.1117/12.2037812

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