8 March 2014 Chip-to-chip optical interconnects based on flexible integrated photonics
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Proceedings Volume 8991, Optical Interconnects XIV; 89910T (2014) https://doi.org/10.1117/12.2037812
Event: SPIE OPTO, 2014, San Francisco, California, United States
Abstract
A high bandwidth density chip-to-chip optical interconnect architecture is analyzed. The interconnect design leverages our recently developed flexible substrate integration technology to circumvent the optical alignment requirement during packaging. Initial experimental results on fabrication and characterization of the flexible photonic platform are also presented.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lan Li, Lan Li, Yi Zou, Yi Zou, Hongtao Lin, Hongtao Lin, Juejun Hu, Juejun Hu, Xiaochen Sun, Xiaochen Sun, Ning-Ning Feng, Ning-Ning Feng, Sylvain Danto, Sylvain Danto, Kathleen Richardson, Kathleen Richardson, Tian Gu, Tian Gu, Michael Haney, Michael Haney, } "Chip-to-chip optical interconnects based on flexible integrated photonics", Proc. SPIE 8991, Optical Interconnects XIV, 89910T (8 March 2014); doi: 10.1117/12.2037812; https://doi.org/10.1117/12.2037812
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