8 March 2014 Plasmonic modulator for three-dimensional chip-to-chip optical interconnects
Author Affiliations +
Proceedings Volume 8991, Optical Interconnects XIV; 89910V (2014) https://doi.org/10.1117/12.2042431
Event: SPIE OPTO, 2014, San Francisco, California, United States
We present a surface-normal plasmonic modulator structure for three-dimensional (3-D) optical interconnects using subwavelength metallic photonic crystals. Optical transmission of the metallic slab was controlled by modulating the plasmonic bandgap of the metallic photonic crystal slab with a moderate index perturbation induced by thermo-optic effects. Our experimental results show that more than 60% modulation depth is achieved with only an index modulation of 0.0043.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fanghui Ren, Fanghui Ren, Xiangyu Wang, Xiangyu Wang, Alan X. Wang, Alan X. Wang, "Plasmonic modulator for three-dimensional chip-to-chip optical interconnects", Proc. SPIE 8991, Optical Interconnects XIV, 89910V (8 March 2014); doi: 10.1117/12.2042431; https://doi.org/10.1117/12.2042431


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