8 March 2014 Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems
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Proceedings Volume 8991, Optical Interconnects XIV; 899114 (2014) https://doi.org/10.1117/12.2040479
Event: SPIE OPTO, 2014, San Francisco, California, United States
Abstract
This paper demonstrates a combined packaging and optical coupling scheme for optoelectronic devices in short distance optical communication systems. The proposed scheme allows an ultra short optical path between the optoelectronic component and the optical waveguide entry. This is achieved by embedding the bare die optoelectronics in the substrate of the optical system. The positioning and alignment of the embedded dies is performed with a scalable passive alignment process based on physical alignment studs which are manufactured with standard photolithography combined with the use of Moiré interference patterns for precise alignment.
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E. Bosman, E. Bosman, B. Van Hoe, B. Van Hoe, J. Missinne, J. Missinne, G. Van Steenberge, G. Van Steenberge, } "Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems", Proc. SPIE 8991, Optical Interconnects XIV, 899114 (8 March 2014); doi: 10.1117/12.2040479; https://doi.org/10.1117/12.2040479
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