27 February 2014 Advanced packaging methods for high-power LED modules
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Abstract
LED luminaires are already beyond retrofit systems, which are limited in heat dissipation due to the old fitting standards. Actual LED luminaries are based on new LED packages and modules. Heat dissipation through the first and second level interconnect is a key issue for a successful LED package. Therefore the impact of known bonding technologies as gluing and soldering and new technologies like sintering and transient liquid phase soldering were analyzed and compared. A realized hermetic high power LED package will be shown as example. The used new techniques result in a module extremely stable against further assembly processes and harsh operating conditions.
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Rafael C. Jordan, Constanze Weber, Christian Ehrhardt, Martin Wilke, "Advanced packaging methods for high-power LED modules", Proc. SPIE 9003, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XVIII, 90030M (27 February 2014); doi: 10.1117/12.2040076; https://doi.org/10.1117/12.2040076
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