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4 March 2014 Novel CMOS time-delay integration using single-photon counting for high-speed industrial and aerospace applications
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Proceedings Volume 9022, Image Sensors and Imaging Systems 2014; 902204 (2014) https://doi.org/10.1117/12.2044850
Event: IS&T/SPIE Electronic Imaging, 2014, San Francisco, California, United States
Abstract
Time-delay integration (TDI) is a popular imaging technique that is used in many applications such as machine vision, dental scanning and satellite earth observation. One of the main advantages of using TDI imagers is the increased effective integration time that is achieved while maintaining high frame-rates. Another use for TDI imagers is with moving objects, such as the earth's surface or industrial machine vision applications, where integration time is limited in order to avoid motion blurs. Such technique may even find its way in mobile and consumer based imaging applications where the reduction in pixel size can limit the performance during low-light and high speed applications. Until recently, TDI was only used with charge-coupled devices (CCDs) mainly due to their charge transfer characteristics. CCDs however, are power consuming and slow when compared to CMOS technology and are no longer favorable for mobile applications. In this work, we report on novel single-photon counting based TDI technique that is implemented in standard CMOS technology allowing for complete camera-on-a-chip solution. The imager was fabricated in a standard CMOS 150 nm 5-metal digital process from LFoundry.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Munir M. El-Desouki and Badeea Al-Azem "Novel CMOS time-delay integration using single-photon counting for high-speed industrial and aerospace applications", Proc. SPIE 9022, Image Sensors and Imaging Systems 2014, 902204 (4 March 2014); https://doi.org/10.1117/12.2044850
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