19 December 2013 High dynamic range image acquisition method for 3D solder paste measurement
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Abstract
In the solder paste inspection measurement system which is based on the structured light vision technology, the local oversaturation will emerge because of the reflection coefficient when the laser light project on PCB surface. As this, a high dynamic imaging acquisition system for the solder paste inspection research is researched to reduce the local oversaturation and misjudge. The Reflective liquid crystal on silicon has the merit that it can adjust the reflectance of the Incident light per-pixel. According to this merit, the high dynamic imaging acquisition system based on liquid crystal on silicon (LCoS) was built which using the high-resolution LCoS and CCD image sensor. The optical system was constructed by the imaging lens, the relay lens, the Polarizing Beam Splitter (PBS), and the hardware system was consist of ARM development board, video generic board, MCU and HX7809 according to the electrical characteristics of LCoS. Tests show that the system could reduce the phenomenon of image oversaturation and improve the quality of image.
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Xiaohui Li, Xiaohui Li, Changku Sun, Changku Sun, Peng Wang, Peng Wang, Yixin Xu, Yixin Xu, } "High dynamic range image acquisition method for 3D solder paste measurement", Proc. SPIE 9046, 2013 International Conference on Optical Instruments and Technology: Optoelectronic Measurement Technology and Systems, 90460T (19 December 2013); doi: 10.1117/12.2036314; https://doi.org/10.1117/12.2036314
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