17 April 2014 The economic impact of EUV lithography on critical process modules
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Abstract
Traditionally, semiconductor density scaling has been supported by optical lithography. The ability of the exposure tools to provide shorter exposure wavelengths or higher numerical apertures have allowed optical lithography be on the forefront of dimensional scaling for the semiconductor industry. Unfortunately, the roadmap for lithography is currently at a juncture of a major paradigm shift. EUV Lithography is steadily maturing but not fully ready to be inserted into HVM. Unfortunately, there are no alternative litho candidates on the horizon that can take over from 193nm. As a result, it is important to look into the insertion point of EUV that would be ideal for the industry from an economical perspective. This paper details the benefit observed by such a transition. Furthermore, it looks into such detail with an EUV throughput sensitivity study.
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Arindam Mallik, Naoto Horiguchi, Jürgen Bömmels, Aaron Thean, Kathy Barla, Geert Vandenberghe, Kurt Ronse, Julien Ryckaert, Abdelkarim Mercha, Laith Altimime, Diederik Verkest, An Steegen, "The economic impact of EUV lithography on critical process modules", Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90481R (17 April 2014); doi: 10.1117/12.2046310; https://doi.org/10.1117/12.2046310
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