17 April 2014 The economic impact of EUV lithography on critical process modules
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Traditionally, semiconductor density scaling has been supported by optical lithography. The ability of the exposure tools to provide shorter exposure wavelengths or higher numerical apertures have allowed optical lithography be on the forefront of dimensional scaling for the semiconductor industry. Unfortunately, the roadmap for lithography is currently at a juncture of a major paradigm shift. EUV Lithography is steadily maturing but not fully ready to be inserted into HVM. Unfortunately, there are no alternative litho candidates on the horizon that can take over from 193nm. As a result, it is important to look into the insertion point of EUV that would be ideal for the industry from an economical perspective. This paper details the benefit observed by such a transition. Furthermore, it looks into such detail with an EUV throughput sensitivity study.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Arindam Mallik, Arindam Mallik, Naoto Horiguchi, Naoto Horiguchi, Jürgen Bömmels, Jürgen Bömmels, Aaron Thean, Aaron Thean, Kathy Barla, Kathy Barla, Geert Vandenberghe, Geert Vandenberghe, Kurt Ronse, Kurt Ronse, Julien Ryckaert, Julien Ryckaert, Abdelkarim Mercha, Abdelkarim Mercha, Laith Altimime, Laith Altimime, Diederik Verkest, Diederik Verkest, An Steegen, An Steegen, "The economic impact of EUV lithography on critical process modules", Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90481R (17 April 2014); doi: 10.1117/12.2046310; https://doi.org/10.1117/12.2046310

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