17 April 2014 Super-flat wafer chucks: from simulation and testing to a complete 300mm wafer chuck with low wafer deformation between pins
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Berliner Glas is a privately owned, mid-sized manufacturer of precision opto-mechanics in Germany. One specialty of Berliner Glas is the design and production of high performance vacuum and electrostatic wafer chucks. Driven by the need of lithography and inspection for smaller overlay values, we pursue the production of an ideally flat wafer chuck. An ideally flat wafer chuck holds a wafer with a completely flat backside and without lateral distortion within the wafer surface.

Key parameters in influencing the wafer chucks effective flatness are thermal performance and thermal management, roughness of the surface, choice of materials and the contact area between wafer and wafer chuck. In this presentation we would like to focus on the contact area. Usually this is decreased as much as possible to avoid sticking effects and the chance of trapped particles between the chuck surface and the backside of the wafer. This can be realized with a pin structure on the chuck surface. Making the pins smaller and moving pins further apart from each other makes the contact area ever smaller but also adds new challenges to achieve a flat and undistorted wafer on the chuck. We would like to address methods of designing and evaluating such a pin structure.

This involves not only the capability to simulate the ideal pattern of pins on the chuck’s surface, for which we will present 2D and 3D simulation results. As well, we would like to share first results of our functional models. Finally, measurement capability has to be ensured, which means improving and further development of Fizeau flatness test interferometers.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Renate Müller, Renate Müller, Kanstantin Afanasiev, Kanstantin Afanasiev, Marcel Ziemann, Marcel Ziemann, Volker Schmidt, Volker Schmidt, "Super-flat wafer chucks: from simulation and testing to a complete 300mm wafer chuck with low wafer deformation between pins", Proc. SPIE 9048, Extreme Ultraviolet (EUV) Lithography V, 90482E (17 April 2014); doi: 10.1117/12.2046209; https://doi.org/10.1117/12.2046209

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