We’ll look at:
• Solutions in the DFT space that let us identify pattern failures hiding in yield loss
• New methods in OPC that allow for process window expansion of problematic hot spots
• Upcoming modeling technologies that target new pattern failure mechanisms in emerging nodes
• New tools in the design spaces that can give designers visibility into the risks of production.
The goal is a pattern aware EDA flow that minimizes risk, enhances manufacturing and quickly finds issues when they occur.
View presentation video on SPIE’s Digital Library: http://dx.doi.org/10.1117/12.2230986.3257945308001