28 March 2014 Front Matter: Volume 9049
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 9049, including the Title Page, Copyright information, Table of Contents, Introduction, and Conference Committee listing.

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from this book:

Author(s), “Title of Paper,” in Alternative Lithographic Technologies VI, edited by Douglas J. Resnick, Christopher Bencher, Proceedings of SPIE Vol. 9049 (SPIE, Bellingham, WA, 2014) Article CID Number.

ISSN: 0277-786X

ISBN: 9780819499721

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Paper Numbering: Proceedings of SPIE follow an e-First publication model, with papers published first online and then in print and on CD-ROM. Papers are published as they are submitted and meet publication criteria. A unique, consistent, permanent citation identifier (CID) number is assigned to each article at the time of the first publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online, print, and electronic versions of the publication. SPIE uses a six-digit CID article numbering system in which:

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Conference Committee

Symposium Chair

  • Harry J. Levinson, GLOBALFOUNDRIES, Inc. (United States)

Symposium Co-chair

  • Mircea V. Dusa, ASML US, Inc. (United States)

Conference Chair

  • Douglas J. Resnick, Molecular Imprints, Inc. (United States)

Conference Co-chair

  • Christopher Bencher, Applied Materials, Inc. (United States)

Conference Program Committee

  • Frank E. Abboud, Intel Corporation (United States)

  • Kenneth R. Carter, University of Massachusetts Amherst (United States)

  • Joy Y. Cheng, IBM Almaden Research Center (United States)

  • Juan J. de Pablo, The University of Chicago (United States)

  • Elizabeth A. Dobisz, HGST (United States)

  • Michael A. Guillorn, IBM Thomas J. Watson Research Center (United States)

  • Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)

  • Daniel J. C. Herr, The University of North Carolina at Greensboro (United States)

  • Tatsuhiko Higashiki, Toshiba Corporation (Japan)

  • James A. Liddle, National Institute of Standards and Technology (United States)

  • Shy-Jay Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)

  • Hans Loeschner, IMS Nanofabrication AG (Austria)

  • John G. Maltabes, Hewlett-Packard Laboratories (United States)

  • Laurent Pain, CEA-LETI (France)

  • Ivo W. Rangelow, Technische Universität Ilmenau (Germany)

  • Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States)

  • Ricardo Ruiz, HGST (United States)

  • Frank M. Schellenberg, Consultant (United States)

  • Helmut Schift, Paul Scherrer Institut (Switzerland)

  • Ines A. Stolberg, Vistec Electron Beam Lithography Group (Germany)

  • William M. Tong, KLA-Tencor Corporation (United States)

  • Kevin T. Turner, University of Pennsylvania (United States)

  • Marco J. Wieland, MAPPER Lithography (Netherlands)

  • Wei Wu, The University of Southern California (United States)

Session Chairs

  • 1 Alternative Lithography Keynote Session

    Douglas J. Resnick, Molecular Imprints, Inc. (United States)

    Christopher Bencher, Applied Materials, Inc. (United States)

  • 2 DSA Process and Integration

    Joy Y. Cheng, IBM Almaden Research Center (United States)

    Lei Wen, HGST (United States)

  • 3 Novel Nanolithography

    Ivo W. Rangelow, Technische Universität Ilmenau (Germany)

    Helmut Schift, Paul Scherrer Institut (Switzerland)

  • 4 Roll to Roll UV Nanoimprint Lithography

    John G. Maltabes, Hewlett-Packard Laboratories (United States)

    Laurent Pain, CEA-LETI (France)

  • 5 Metrology and Inspection for Directed Self-Assembly: Joint Session with Conferences 9049 and 9050

    Martha I. Sanchez, IBM Research-Almaden (United States)

    Daniel J. C. Herr, The University of North Carolina at Greensboro (United States)

  • 6 Beam Lithography

    James A. Liddle, National Institute of Standards and Technology (United States)

    Ines A. Stolberg, Vistec Electron Beam GmbH (Germany)

  • 7 DSA Materials and Processes I: Joint Session with Conferences 9049 and 9051

    Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States)

    Roel Gronheid, IMEC (Belgium)

  • 8 DSA Materials and Processes II: Joint Session with 9049 and 9051

    James A. Liddle, National Institute of Standards and Technology (United States)

    Ralph R. Dammel, AZ Electronic Materials USA Corp. (United States)

  • 9 Step and Repeat UV Nanoimprint Lithography

    Tatsuhiko Higashiki, Toshiba Corporation (Japan)

    Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan)

  • 10 Multiple Electron Beam Direct Write Lithography

    Hans Loeschner, IMS Nanofabrication AG (Austria)

    Frank E. Abboud, Intel Corporation (United States)

  • 11 DSA Line Patterning

    Frank M. Schellenberg, Consultant (United States)

  • 12 Nanodevice Fabrication

    Kevin T. Turner, University of Pennsylvania (United States)

  • 13 DSA Design for Manufacturability: Joint Session with Conferences 9049, 9052, and 9053

    Michael A. Guillorn, IBM Thomas J. Watson Research Center (United States)

    Bruce W. Smith, Rochester Institute of Technology (United States)

  • 14 DSA Via Patterning

    Ricardo Ruiz, HGST (United States)

    Shy-Jay Lin, Taiwan Semiconductor Manufacturing Company Ltd. (Taiwan)

© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter: Volume 9049", Proc. SPIE 9049, Alternative Lithographic Technologies VI, 904901 (28 March 2014); doi: 10.1117/12.2065573; https://doi.org/10.1117/12.2065573
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