28 March 2014 Hard disk drive thin film head manufactured using nanoimprint lithography
Author Affiliations +
The lithographic requirements for the thin film head industry are comparable to the semiconductor industry for certain parameters such as resolution and pattern repeatability. In other aspects such as throughput and defectivity, the requirements tend to be more relaxed. These requirements match well with the strengths and weaknesses reported concerning nanoimprint lithography (NIL) and suggest an alternative approach to optical lithography. We have demonstrated the proof of concept of using NIL patterning, in particular Jet and FlashTM Imprint Lithography (J-FILTM) 1 , to build functional thin film head devices with performance comparable to standard wafer processing techniques. An ImprioTM 300 tool from Molecular Imprints, Inc. (MII) was modified to process the AlTiC ceramic wafers commonly used in the thin film head industry. Templates were produced using commercially viable photomask manufacturing processes and the AlTiC wafer process flow was successfully modified to support NIL processing. Future work is identified to further improve lithographic performance including residual layer thickness uniformity, wafer topography, NIL→NIL overlay, and development of a large imprint field that exceeds what is available in optical lithography.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Daniel B. Sullivan, Daniel B. Sullivan, Thomas Boonstra, Thomas Boonstra, Mark T. Kief, Mark T. Kief, Lily Youtt, Lily Youtt, Sethuraman Jayashankar, Sethuraman Jayashankar, Carolyn Van Dorn, Carolyn Van Dorn, Harold Gentile, Harold Gentile, Sriram Viswanathan, Sriram Viswanathan, Dexin Wang, Dexin Wang, Dion Song, Dion Song, Dongsung Hong, Dongsung Hong, Sung-Hoon Gee, Sung-Hoon Gee, "Hard disk drive thin film head manufactured using nanoimprint lithography", Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90490Z (28 March 2014); doi: 10.1117/12.2048829; https://doi.org/10.1117/12.2048829

Back to Top