Evaluation of integration schemes for contact-hole grapho-epitaxy DSA: a study of substrate  and template affinity control

A. Romo-Negreira; T. R. Younkin; R. Gronheid; S. Demuynck; N. Vandenbroeck; T. Seo; D. J. Guerrero; D. Parnell; M. Muramatsu; S. Kawakami; T. Yamauchi; K. Nafus; M. H. Somervell

doi:10.1117/12.2046119

28 March 2014 Evaluation of integration schemes for contact-hole grapho-epitaxy DSA: a study of substrate and template affinity control

A. Romo-Negreira; T. R. Younkin; R. Gronheid; S. Demuynck; N. Vandenbroeck; T. Seo; D. J. Guerrero; D. Parnell; M. Muramatsu; S. Kawakami; T. Yamauchi; K. Nafus; M. H. Somervell

Author Affiliations +

Proceedings Volume 9049, Alternative Lithographic Technologies VI; 90491L (2014) https://doi.org/10.1117/12.2046119
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

An electrical test vehicle for fabricating direct self-assembly (DSA) sub-30 nm via interconnects has been fabricated employing a soft mask grapho-epitaxy contact-hole shrink. The generation of the resist pre-pattern was carried out using 193i lithography on three different stacks and the BCP assembly was evaluated with and without template affinity control on the resist pre-pattern. After DSA shrink, the holes were transferred in a 100 nm oxide for standard Tungsten metallization for electrical characterization.

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A. Romo-Negreira, A. Romo-Negreira, T. R. Younkin, T. R. Younkin, R. Gronheid, R. Gronheid, S. Demuynck, S. Demuynck, N. Vandenbroeck, N. Vandenbroeck, T. Seo, T. Seo, D. J. Guerrero, D. J. Guerrero, D. Parnell, D. Parnell, M. Muramatsu, M. Muramatsu, S. Kawakami, S. Kawakami, T. Yamauchi, T. Yamauchi, K. Nafus, K. Nafus, M. H. Somervell, M. H. Somervell, } "Evaluation of integration schemes for contact-hole grapho-epitaxy DSA: a study of substrate and template affinity control", Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90491L (28 March 2014); doi: 10.1117/12.2046119; https://doi.org/10.1117/12.2046119

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