28 March 2014 REBL DPG lenslet structure: design for charging prevention
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Abstract
KLA-Tencor is currently developing Reflective Electron Beam Lithography (REBL), targeted as a production worthy multiple electron beam tool for next generation high volume lithography. The Digital Pattern Generator (DPG) integrated with CMOS and MEMS lenslets is a critical part of REBL. Previously, KLA-Tencor reported on progress towards a REBL tool for maskless lithography below the 10 nm technology node. However, the MEMS lenslet structure suffered from charging up during writing, requiring the usage of a charge drain coating. Since then, the TSMC multiple e-beam team and the KLA-Tencor REBL team have worked together to further develop the DPG for direct write lithography. In this paper, we introduce a hollow-structure MEMS lenslet array that inherently prevents charging during writing, and preliminary verification results are also presented.
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Shy-Jay Lin, Shy-Jay Lin, T. I. Bao, T. I. Bao, C. W. Lu, C. W. Lu, S.-C. Wang, S.-C. Wang, T. C. Chien, T. C. Chien, J.-J. Shin, J.-J. Shin, Burn J. Lin, Burn J. Lin, Mark A. McCord, Mark A. McCord, Alan Brodie, Alan Brodie, Allen Carroll, Allen Carroll, Luca Grella, Luca Grella, } "REBL DPG lenslet structure: design for charging prevention", Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90491X (28 March 2014); doi: 10.1117/12.2045416; https://doi.org/10.1117/12.2045416
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