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28 March 2014 REBL DPG lenslet structure: design for charging prevention
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KLA-Tencor is currently developing Reflective Electron Beam Lithography (REBL), targeted as a production worthy multiple electron beam tool for next generation high volume lithography. The Digital Pattern Generator (DPG) integrated with CMOS and MEMS lenslets is a critical part of REBL. Previously, KLA-Tencor reported on progress towards a REBL tool for maskless lithography below the 10 nm technology node. However, the MEMS lenslet structure suffered from charging up during writing, requiring the usage of a charge drain coating. Since then, the TSMC multiple e-beam team and the KLA-Tencor REBL team have worked together to further develop the DPG for direct write lithography. In this paper, we introduce a hollow-structure MEMS lenslet array that inherently prevents charging during writing, and preliminary verification results are also presented.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shy-Jay Lin, T. I. Bao, C. W. Lu, S.-C. Wang, T. C. Chien, J.-J. Shin, Burn J. Lin, Mark A. McCord, Alan Brodie, Allen Carroll, and Luca Grella "REBL DPG lenslet structure: design for charging prevention", Proc. SPIE 9049, Alternative Lithographic Technologies VI, 90491X (28 March 2014);

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