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Symposium Co-chair
Conference Chair
Conference Co-chair
Conference Program Committee
Ofer Adan, Applied Materials (Israel) John A. Allgair, GLOBALFOUNDRIES Inc. (United States) Masafumi Asano, Toshiba Corporation (Japan) Benjamin D. Bunday, SEMATECH Inc. (United States) Alek C. Chen, ASML Taiwan Ltd. (Taiwan) Shaunee Y. Cheng, IMEC (Belgium) Timothy F. Crimmins, Intel Corporation (United States) Daniel J. C. Herr, The University of North Carolina at Greensboro (United States) Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) Shunsuke Koshihara, Hitachi High-Technologies Corporation (Japan) Yi-Sha Ku, Industrial Technology Research Institute (Taiwan) Byoung-Ho Lee, Ultratech (United States) Christopher J. Raymond, Nanometrics Inc. (United States) John C. Robinson, KLA-Tencor Corporation (United States) Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States) Richard Silver, National Institute of Standards and Technology (United States) Eric Solecky, IBM Corporation (United States) Costas J. Spanos, University of California, Berkeley (United States) Alexander Starikov, I&I Consulting (United States) Vladimir A. Ukraintsev, Nanometrology International, Inc. (United States) Alok Vaid, GLOBALFOUNDRIES Inc. (United States)
Session Chairs
1 Keynote Session Martha I. Sanchez, IBM Almaden Research Center (United States) 2 Hybrid and Virtual Metrology Techniques John C. Robinson, KLA-Tencor Corporation (United States) Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States) 3 Metrology of 3D Structures Masafumi Asano, Toshiba Corporation (Japan) Alok Vaid, GLOBALFOUNDRIES Inc. (United States) 4 SEM Simulation and Emulation I: Joint Session with Conferences 9050 and 9051 Shunsuke Koshihara, Hitachi High-Technologies Corporation (Japan) Thomas I. Wallow, ASML US, Inc. (United States) 5 SEM Simulation and Emulation II: Joint Session with Conferences 9050 and 9051 Benjamin D. Bunday, SEMATECH Inc. (United States) Clifford L. Henderson, Georgia Institute of Technology (United States) 6 Metrology and Inspection for Directed Self-Assembly: Joint Session with Conferences 9049 and 9050 Martha I. Sanchez, IBM Research - Almaden (United States) Daniel J. C. Herr, The University of North Carolina at Greensboro (United States) 7 Metrology for Process Control Costas J. Spanos, University of California, Berkeley (United States) Alexander Starikov, I&I Consulting (United States) 8 SEM, AFM, and SPM Masafumi Asano, Toshiba Corporation (Japan) Shunsuke Koshihara, Hitachi High-Technologies Corporation (Japan) 9 X-Ray Scattering Methods John A. Allgair, GLOBALFOUNDRIES Inc. (United States) Richard M. Silver, National Institute of Standards and Technology (United States) 10 Overlay Measurement and Control: Joint Session with Conferences 9050 and 9052 Alexander Starikov, I&I Consulting (United States) Pary Baluswamy, Micron Technology, Inc. (United States) 11 Inspection Timothy F. Crimmins, Intel Corporation (United States) Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) 12 Scatterometry and Optical Methods Matthew J. Sendelbach, Nova Measuring Instruments Inc. (United States) Eric Solecky, IBM Corporation (United States) 13 Reference Metrology, Accuracy, Standards Benjamin D. Bunday, SEMATECH Inc. (United States) Alexander Starikov, I&I Consulting (United States) 14 Overlay Chih-Ming Ke, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan) John C. Robinson, KLA-Tencor Corporation (United States) 15 Late Breaking News Jason P. Cain, Advanced Micro Devices, Inc. (United States) Ofer Adan, Applied Materials (Israel)
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