2 April 2014 Investigation of a methodology for in-film defects detection on film coated blank wafers
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Multi-patterning is one of the commonly used processes to shrink device node dimensions. With the miniaturization of the device node and the increasing number of coated layers and lithography processes, needs for defect reduction and control are getting stronger. Although there are needs for detecting in-film defects during the lithography process, it is difficult to verify in-film defects detected by an optical inspection tool because in-film defects usually appear as SEM Non-Visuals (SNV) during defect review using a scanning electron microscope (SEM). This makes the tuning of optical inspection tools difficult since these defects may be considered as noise. However, if these defects are “real defects”, they will have a negative impact to manufacturing yield. In this paper, we investigate a new methodology to detect in-film defects with high sensitivity utilizing a broadband plasma inspection tool. This methodology is expected to allow the early detection of in-film defects before the pattern formation, hence improving device manufacturing yield.
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Akiko Kiyotomi, Akiko Kiyotomi, Arnaud Dauendorffer, Arnaud Dauendorffer, Satoru Shimura, Satoru Shimura, Shinobu Miyazaki, Shinobu Miyazaki, Takemasa Miyagi, Takemasa Miyagi, Shigeru Ota, Shigeru Ota, Koji Haneda, Koji Haneda, Oksen Baris, Oksen Baris, Junwei Wei, Junwei Wei, "Investigation of a methodology for in-film defects detection on film coated blank wafers", Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 905024 (2 April 2014); doi: 10.1117/12.2045737; https://doi.org/10.1117/12.2045737

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