2 April 2014 Handling, clamping, and alignment evaluation for multi-beam technology on Matrix1.1 platform
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Abstract
The MATRIX platform integrates new types of modules for handling and alignment capability and this represents two new and innovative aspects for multi-beam lithography. Results on performances in terms of robustness of the different modules in real manufacturing conditions, including the interface of the MATRIX platform with the SOKUDO DUO track will be reported. A new type of alignment solution was developed by MAPPER. This paper will show the first results on alignment sensor repeatability. Preliminary results on the overlay performance of the MATRIX platform will be presented and discussion will be engaged to position the MAPPER alignment concept with respect to the ITRS roadmap expectations.
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Ludovic Lattard, Ludovic Lattard, Jonathan Pradelles, Jonathan Pradelles, Niels Vergeer, Niels Vergeer, Erwin Slot, Erwin Slot, Laurent Pain, Laurent Pain, Erik de Jong, Erik de Jong, Gianpaolo Torriani, Gianpaolo Torriani, Charles Pieczulewski, Charles Pieczulewski, } "Handling, clamping, and alignment evaluation for multi-beam technology on Matrix1.1 platform", Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90502E (2 April 2014); doi: 10.1117/12.2046233; https://doi.org/10.1117/12.2046233
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