SEM-contour shape analysis based on circuit structure for advanced systematic defect inspection

Yasutaka Toyoda; Hiroyuki Shindo; Yutaka Hojo; Daisuke Fuchimoto

doi:10.1117/12.2046655

2 April 2014 SEM-contour shape analysis based on circuit structure for advanced systematic defect inspection

Yasutaka Toyoda, Hiroyuki Shindo, Yutaka Hojo, Daisuke Fuchimoto

Proceedings Volume 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII; 90502V (2014) https://doi.org/10.1117/12.2046655
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

We have developed a practicable measurement technique that can help to achieve reliable inspections for systematic defects in advanced semiconductor devices. Systematic defects occurring in the design and mask processes are a dominant component of integrated circuit yield loss in nano-scaled technologies. Therefore, it is essential to ensure systematic defects are detected at an early stage of wafer fabrication. In the past, printed pattern shapes have been evaluated by human eyes or by taking manual critical dimension (CD) measurements. However, these operations are sometimes unstable and inaccurate. Last year, we proposed a new technique for taking measurements by using a SEM contour [1]. This technique enables a highly precise quantification of various complex 2D shaped patterns by comparing a contour extracted from a SEM image using a CD measurement algorithm and an ideal pattern. We improved this technique to enable the carrying out of inspections suitable for every pattern structure required for minimizing the process margin. This technique quantifies a pattern shape of a target-layer pattern using information on a multi-layered circuit structure. This enabled it to confirm the existence of a critical defect in a circuit connecting upper/lower-layers. This paper describes the improved technique and the evaluation results obtained in evaluating it in detail.

Citation Download Citation

Yasutaka Toyoda, Hiroyuki Shindo, Yutaka Hojo, and Daisuke Fuchimoto "SEM-contour shape analysis based on circuit structure for advanced systematic defect inspection", Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 90502V (2 April 2014); https://doi.org/10.1117/12.2046655

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available