2 April 2014 The effect of individually-induced processes on image-based overlay and diffraction-based overlay
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Abstract
In this paper, set of wafers with separated processes was prepared and overlay measurement result was compared in two methods; IBO and DBO. Based on the experimental result, theoretical approach of relationship between overlay mark deformation and overlay variation is presented. Moreover, overlay reading simulation was used in verification and prediction of overlay variation due to deformation of overlay mark caused by induced processes. Through this study, understanding of individual process effects on overlay measurement error is given. Additionally, guideline of selecting proper overlay measurement scheme for specific layer is presented.
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SeungHwa Oh, Jeongjin Lee, Seungyoon Lee, Chan Hwang, Gilheyun Choi, Ho-Kyu Kang, EunSeung Jung, "The effect of individually-induced processes on image-based overlay and diffraction-based overlay", Proc. SPIE 9050, Metrology, Inspection, and Process Control for Microlithography XXVIII, 905039 (2 April 2014); doi: 10.1117/12.2046583; https://doi.org/10.1117/12.2046583
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