14 April 2014 Front Matter: Volume 9051
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 9051, including the Title Page, Copyright information, Table of Contents, Invited Panel Discussion, and Conference Committee listing.
Wallow and Hohle: Front Matter: Volume 9051

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from this book:

Author(s), “Title of Paper,” in Advances in Patterning Materials and Processes XXXI, edited by Thomas I. Wallow, Christoph K. Hohle, Proceedings of SPIE Vol. 9051 (SPIE, Bellingham, WA, 2014) Article CID Number.

ISSN: 0277-786X

ISBN: 9780819499745

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Paper Numbering: Proceedings of SPIE follow an e-First publication model, with papers published first online and then in print and on CD-ROM. Papers are published as they are submitted and meet publication criteria. A unique, consistent, permanent citation identifier (CID) number is assigned to each article at the time of the first publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online, print, and electronic versions of the publication. SPIE uses a six-digit CID article numbering system in which:

  • The first four digits correspond to the SPIE volume number.

  • The last two digits indicate publication order within the volume using a Base 36 numbering system employing both numerals and letters. These two-number sets start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B … 0Z, followed by 10-1Z, 20-2Z, etc.

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Conference Committee

Symposium Chair

  • Harry J. Levinson, GLOBALFOUNDRIES, Inc. (United States)

Symposium Co-chair

  • Mircea V. Dusa, ASML US, Inc. (United States)

Conference Chair

  • Thomas I. Wallow, ASML US, Inc. (United States)

Conference Co-chair

  • Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems IPMS (Germany)

Conference Program Committee

  • Robert Allen, IBM Almaden Research Center (United States)

  • Ramakrishnan Ayothi, JSR Micro, Inc. (United States)

  • Luisa D. Bozano, IBM Almaden Research Center (United States)

  • Sean D. Burns, IBM Corporation (United States)

  • Ralph R. Dammel, AZ Electronic Materials USA Corporation (United States)

  • Roel Gronheid, IMEC (Belgium)

  • Douglas Guerrero, Brewer Science, Inc. (United States)

  • Clifford L. Henderson, Georgia Institute of Technology (United States)

  • Scott W. Jessen, Texas Instruments Inc. (United States)

  • Yoshio Kawai, Shin-Etsu Chemical Co., Ltd. (Japan)

  • Qinghuang Lin, IBM Thomas J. Watson Research Center (United States)

  • Nobuyuki N. Matsuzawa, Sony Corporation (Japan)

  • Dah-Chung Owe-Yang, Shin-Etsu MicroSi, Inc. (United States)

  • Daniel P. Sanders, IBM Almaden Research Center (United States)

  • Mark H. Somervell, Tokyo Electron America, Inc. (United States)

  • James W. Thackeray, Dow Electronic Materials (United States)

  • Plamen Tzviatkov, FUJIFILM Electronic Materials U.S.A., Inc. (United States)

  • Todd R. Younkin, Intel Corporation (Belgium)

Session Chairs

  • 1 Keynote Session

    Thomas I. Wallow, ASML US, Inc. (United States)

    Christoph K. Hohle, Fraunhofer Institute for Photonics Microsystems IPMS (Germany)

  • 2 New EUV Resist Materials: Joint Session with Conferences 9048 and 9051

    Robert L. Brainard, College of Nanoscale Science & Engineering, University at Albany (United States)

    James W. Thackeray, Dow Electronic Materials (United States)

  • 3 Stochastics and EUV Process Improvements: Joint Session with Conferences 9048 and 9051

    Roel Gronheid, IMEC (Belgium)

    Uzodinma Okoroanyanwu, GLOBALFOUNDRIES Inc. (Germany)

  • 4 SEM Simulation and Emulation I: Joint Session with Conferences 9050 and 9051

    Shunsuke Koshihara, Hitachi High-Technologies Corporation (Japan)

    Thomas I. Wallow, ASML US, Inc. (United States)

  • 5 SEM Simulation and Emulation II: Joint Session with Conferences 9050 and 9051

    Benjamin D. Bunday, SEMATECH Inc. (United States)

    Clifford L. Henderson, Georgia Institute of Technology (United States)

  • 6 New Materials and Processes

    Robert Allen, IBM Almaden Research Center (United States)

    Ramakrishnan Ayothi, JSR Micro, Inc. (United States)

  • 7 DSA Materials I

    Ralph R. Dammel, AZ Electronic Materials USA Corporation (United States)

    Douglas Guerrero, Brewer Science, Inc. (United States)

  • 8 DSA Materials and Processes I: Joint Session with Conferences 9049 and 9051

    Benjamen M. Rathsack, Tokyo Electron America, Inc. (United States)

    Roel Gronheid, IMEC (Belgium)

  • 9 DSA Materials and Processes II: Joint Session with 9049 and 9051

    James A. Liddle, National Institute of Standards and Technology (United States)

    Sean D. Burns, IBM Corporation (United States)

  • 10 Materials and Process Fundamentals

    Todd R. Younkin, Intel Corporation (United States)

    Clifford L. Henderson, Georgia Institute of Technology (United States)

  • 11 Advanced Patterning Processes

    Plamen Tzviatkov, FUJIFILM Electronic Materials U.S.A., Inc. (United States)

    Douglas Guerrero, Brewer Science, Inc. (United States)

  • 12 DSA Materials II

    Mark H. Somervell, Tokyo Electron America, Inc. (United States)

    Daniel P. Sanders, IBM Almaden Research Center (United States)

  • 13 Underlayers and Spin-on Materials Processing

    Robert Allen, IBM Almaden Research Center (United States)

    Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems IPMS (Germany)

  • 14 EUV Materials

    Scott W. Jessen, Texas Instruments Inc. (United States)

    Thomas I. Wallow, ASML US, Inc. (United States)

© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 9051", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 905101 (14 April 2014); doi: 10.1117/12.2053822; https://doi.org/10.1117/12.2053822
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