Directed Self-Assembly (DSA) is one of the most promising technologies for scaling feature sizes to 16 nm and below.
Both line/space and hole patterns can be created with various block copolymer morphologies, and these materials allow
for molecular-level control of the feature shapes—exactly the characteristics that are required for creating high fidelity
lithographic patterns. Over the past five years, the industry has been addressing the technical challenges of maturing this
technology by addressing concerns such as pattern defectivity, materials specifications, design layout, and tool
requirements. Though the learning curve has been steep, DSA has made significant progress toward implementation
in high-volume manufacturing.
Tokyo Electron has been focused on the best methods of achieving high-fidelity patterns using DSA processing. Unlike
other technologies where optics and photons drive the formation of patterns, DSA relies on surface interactions and
polymer thermodynamics to determine the final pattern shapes. These phenomena, in turn, are controlled by the
processing that occurs on clean-tracks, etchers, and cleaning systems, and so a host of new technology has been
developed to facilitate DSA. In this paper we will discuss the processes and hardware that are emerging as critical
enablers for DSA implementation, and we will also demonstrate the kinds of high fidelity patterns typical of mainstream