27 March 2014 In-situ analysis of defect formation in coat develop track process
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Typical defects to be resolved during coat-develop track processing have been confirmed during each resist generation; I-line, KrF, ArF, ArF immersion, and recently EUVV.[1-5] In this study, two types of defect formation were analyzed: organic film post coating non-uniformity spots and post develop water-marks. During substrate rotation,, a high-speed video camera is used to observe characteristic phenomena which lead to the generation of these rather typical defects. Post coating non-uniformity defects were linked to bubble formation, and post develop defects were associated with thee wafer drying conditions. By correlating high-speed camera images and defect inspection results from several different resists we can disclose the defect generation mechanism of multiple typical phenomena.
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Masahiko Harumoto, Harold Stokes, Osamu Tamada, Tadashi Miyagi, Koji Kaneyama, Charles Pieczulewski, Masaya Asai, "In-situ analysis of defect formation in coat develop track process", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90510P (27 March 2014); doi: 10.1117/12.2045876; https://doi.org/10.1117/12.2045876

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