28 March 2014 Optimizing standard cell design for quality
Author Affiliations +
Abstract
To date, majority of the papers presented in the conference focused on how to print smaller transistors that run faster. In a different market such as safety-focused automotive market, “smaller and faster” are replaced by “tougher and living longer”. In such a market, a chip has to endure a wide range of operating temperature from -40C to 150C, and is required to have an extremely low field failure rate over 10+ years. There is a wide range of design techniques that can be deployed to improve the quality of a chip. In this paper, we present some of these design techniques that are related to the physical aspects of standard cells.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chimin Yuan, Chimin Yuan, Dave Tipple, Dave Tipple, Jeff Warner, Jeff Warner, } "Optimizing standard cell design for quality", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530O (28 March 2014); doi: 10.1117/12.2045660; https://doi.org/10.1117/12.2045660
PROCEEDINGS
8 PAGES


SHARE
Back to Top