28 March 2014 Localization concept of re-decomposition area to fix hotspots for LELE process
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Abstract
Litho-Etch-Litho-Etch (LELE) type double patterning technology (DPT) is known to have an advantage of layout flexibility. However, there are two problems when a hotspot, which is not fixable by tuning OPC, is detected. One is repeating a data preparation flow including decomposition, OPC, and verification by lithography simulation is quite time consuming. The other is a risk to introduce new hotspots at different locations. In this report, a new method to fix hotspots with layout modification of limited area will be presented. The proposed method can reduce not only turnaround time to fix a hotspot but also the number of iterations since it prevents generation of hotspots at new locations.
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Yoko Yokoyama, Keishi Sakanushi, Yukihide Kohira, Atsushi Takahashi, Chikaaki Kodama, Satoshi Tanaka, Shigeki Nojima, "Localization concept of re-decomposition area to fix hotspots for LELE process ", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530V (28 March 2014); doi: 10.1117/12.2046263; https://doi.org/10.1117/12.2046263
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