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Patterning challenges in the fabrication of 12 nm half-pitch dual damascene copper ultra low-k interconnects
Plasma etching and integration challenges using alternative patterning techniques for 11nm node and beyond
Large-radius neutral beam enhanced chemical vapor deposition process for non-porous ultra-low-k SiOCH
A comparison of the pattern transfer of line-space patterns from graphoepitaxial and chemoepitaxial block co-polymer directed self-assembly
Directed self-assembly of PS-b-PDMS into 193nm photoresist patterns and transfer into silicon by plasma etching
Dual frequency mid-gap capacitively coupled plasma (m-CCP) for conventional and DSA patterning at 10nm node and beyond