22 April 2014 Front Matter: Volume 9054
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 9054 including the Title Page, Copyright information, Table of Contents, Introduction, and Conference Committee listing.
Oehrlein and Lin: Front Matter: Volume 9054

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from this book:

Author(s), “Title of Paper,” in Advanced Etch Technology for Nanopatterning III, edited by Gottlieb S. Oehrlein, Qinghuang Lin, Proceedings of SPIE Vol. 9054 (SPIE, Bellingham, WA, 2014) Article CID Number.

ISSN: 0277-786X

ISBN: 9780819499776

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Conference Committee

Symposium Chair

  • Harry J. Levinson, GLOBALFOUNDRIES, Inc. (United States)

Symposium Co-chair

  • Mircea V. Dusa, ASML US, Inc. (United States)

Conference Chair

  • Gottlieb S. Oehrlein, University of Maryland, College Park (United States)

Conference Co-chair

  • Qinghuang Lin, IBM Thomas J. Watson Research Center (United States)

Conference Program Committee

  • Julie Bannister, Tokyo Electron America, Inc. (United States)

  • Charles T. Black, Brookhaven National Laboratory (United States)

  • Maxime Darnon, LTM CNRS (France)

  • Sebastian U. Engelmann, IBM Thomas J. Watson Research Center (United States)

  • Eric A. Hudson, LAM Research Corporation (United States)

  • Catherine B. Labelle, GLOBALFOUNDRIES Inc. (United States)

  • Nae-Eung Lee, Sungkyunkwan University (Korea, Republic of)

  • Erwine Pargon, LTM CNRS (France)

  • Ricardo Ruiz, HGST (United States)

  • Seiji Samukawa, Tohoku University (Japan)

  • Denis Shamiryan, MAPPER Lithography B.V. (Netherlands)

  • Rich Wise, IBM Corporation (United States)

  • Anthony Yen, TSMC Taiwan (Taiwan)

  • Ying Zhang, Applied Materials, Inc. (United States)

  • Jeff Xu, Qualcomm Technologies Inc. (United States)

Session Chairs

  • 1 Reviews and Overviews of Nanopatterning Challenges

    Cathy Labelle, GLOBALFOUNDRIES Inc. (United States)

    Rich Wise, IBM Corpoation (United States)

  • 2 Nanopatterning for Advanced Logic and Memory Technology Nodes

    Denis Shamiryan, MAPPER Lithography (Netherlands)

    Eric A. Hudson, LAM Research Corporation (United States)

  • 3 Plasma and Resist Interactions, Including Patterning Quality Control (LER, CD Uniformity, etc.)

    Sebastian U. Engelmann, IBM Thomas J. Watson Research Center (United States)

  • 4 Patterning Integration Schemes (multilayer patterning, self-aligned patterning, etc.)

    Maxime Darnon, LTM CNRS (France)

    Nae-Eung Lee, Sungkyunkwan University (Korea, Republic of)

  • 5 New Plasma Sources and New Etching Technologies

    Seiji Samukawa, Tohoku University (Japan)

    Julie Bannister, Tokyo Electron America, Inc. (United States)

  • 6 Emerging Patterning Technologies (DSA and others)

    Ying Zhang, Applied Materials, Inc. (Taiwan)

    Ricardo Ruiz, HGST (United States)

Introduction

This proceedings volume contains selected papers presented at the conference Advanced Etch Technology for Nanopatterning III held February 24-25, 2014 as part of the SPIE Advanced Lithography Symposium 2014. The meeting featured six sessions of oral presentations to highlight important achievements and challenges in the following areas of Advanced Etch Technology for Nanopatterning:

Session 1: Reviews and Overviews of Nanopatterning Challenges

Session 2: Nanopatterning for Advanced Logic and Memory Technology Nodes

Session 3: Plasma and Resist Interactions, Including Patterning Quality Control (LER, CD Uniformity, etc.)

Session 4: Patterning Integration Schemes (multilayer patterning, self-aligned patterning, etc.)

Session 5: New Plasma Sources and New Etching Technologies

Session 6: Emerging Patterning Technologies (DSA and others)

Additionally, there was a poster session.

We would like to thank all speakers and presenters for their stimulating contributions to the conference. We also would like to express our gratitude to the SPIE Advanced Lithography “Advanced Etch Technology for Nanopatterning III” Conference Committee members for their contributions in organizing this very successful conference. Finally, we would like to thank SPIE and its staff for support of this conference and their arrangements.

Gottlieb S. Oehrlein

Qinghuang Lin

© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 9054", Proc. SPIE 9054, Advanced Etch Technology for Nanopatterning III, 905401 (22 April 2014); doi: 10.1117/12.2064485; https://doi.org/10.1117/12.2064485
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