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9 March 2014 Characterisation of CFRP adhesive bonds by electromechanical impedance
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In aircraft industry the Carbon Fiber Reinforced Polymer (CFRP) elements are joint using rivets and adhesive bonding. The reliability of the bonding limits the use of adhesive bonding for primary aircraft structures, therefore it is important to assess the bond quality. The performance of adhesive bonds depends on the physico-chemical properties of the adhered surfaces. The contamination leading to weak bonds may have various origin and be caused by moisture, release agent, hydraulic fluid, fuel, poor curing of adhesive and so on. In this research three different causes of possible weak bonds were selected for the investigation: 1. Weak bond due to release agent contamination, 2. Weak bond due to moisture contamination, 3. Weak bond due to poor curing of the adhesive. In order to assess the bond quality electromechanical impedance (EMI) technique was selected and investigation was focused on the influence of bond quality on electrical impedance of piezoelectric transducer. The piezoelectric transducer was mounted at the middle of each sample surface. Measurements were conducted using HIOKI Impedance Analyzer IM3570. Using the impedance analyzer the electrical parameters were measured for wide frequency band. Due to piezoelectric effect the electrical response of a piezoelectric transducer is related to mechanical response of the sample to which the transducers is attached. The impedance spectra were investigated in order to find indication of the weak bonds. These spectra were compared with measurements for reference sample using indexes proposed in order to assess the bond quality.
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Pawel H. Malinowski, Tomasz Wandowski, and Wieslaw M. Ostachowicz "Characterisation of CFRP adhesive bonds by electromechanical impedance", Proc. SPIE 9064, Health Monitoring of Structural and Biological Systems 2014, 906415 (9 March 2014);

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