28 March 2014 Monitoring of acoustic emission activity using thin wafer piezoelectric sensors
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Abstract
Acoustic emission (AE) is a well-known technique for monitoring onset and propagation of material damage. The technique has demonstrated utility in assessment of metallic and composite materials in applications ranging from civil structures to aerospace vehicles. While over the course of few decades AE hardware has changed dramatically with the sensors experiencing little changes. A traditional acoustic emission sensor solution utilizes a thickness resonance of the internal piezoelectric element which, coupled with internal amplification circuit, results in relatively large sensor footprint. Thin wafer piezoelectric sensors are small and unobtrusive, but they have seen limited AE applications due to low signal-to-noise ratio and other operation difficulties. In this contribution, issues and possible solutions pertaining to the utility of thin wafer piezoelectrics as AE sensors are discussed. Results of AE monitoring of fatigue damage using thin wafer piezoelectric and conventional AE sensors are presented.
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Blaine Trujillo, Blaine Trujillo, Andrei Zagrai, Andrei Zagrai, Daniel Meisner, Daniel Meisner, Sepand Momeni, Sepand Momeni, } "Monitoring of acoustic emission activity using thin wafer piezoelectric sensors", Proc. SPIE 9064, Health Monitoring of Structural and Biological Systems 2014, 906418 (28 March 2014); doi: 10.1117/12.2047979; https://doi.org/10.1117/12.2047979
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