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Organized by Department of Applied Physics, College of Science, Donghua University (China) State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University (China) Optical Coating and Materials Department, Shanghai Institute of Technical Physics, CAS (China) Sponsored by National Natural Science Foundation of China (China) Science and Technology Commission of Shanghai Municipality (China) Chinese Physics Society (China) Shanghai Physics Society (China) The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon. Please use the following format to cite material from this book: Author(s), “Title of Paper,” in Eighth International Conference on Thin Film Physics and Applications, edited by Junhao Chu, Chunrui Wang, Proceedings of SPIE Vol. 9068 (SPIE, Bellingham, WA, 2013) Article CID Number. ISSN: 0277-786X ISBN: 9780819499974 Published by SPIE P.O. Box 10, Bellingham, Washington 98227-0010 USA Telephone +1 360 676 3290 (Pacific Time) · Fax +1 360 647 1445 Copyright © 2013, Society of Photo-Optical Instrumentation Engineers. Copying of material in this book for internal or personal use, or for the internal or personal use of specific clients, beyond the fair use provisions granted by the U.S. Copyright Law is authorized by SPIE subject to payment of copying fees. The Transactional Reporting Service base fee for this volume is $18.00 per article (or portion thereof), which should be paid directly to the Copyright Clearance Center (CCC), 222 Rosewood Drive, Danvers, MA 01923. Payment may also be made electronically through CCC Online at copyright.com. Other copying for republication, resale, advertising or promotion, or any form of systematic or multiple reproduction of any material in this book is prohibited except with permission in writing from the publisher. The CCC fee code is 0277-786X/13/$18.00. Printed in the United States of America. Publication of record for individual papers is online in the SPIE Digital Library.
Paper Numbering: Proceedings of SPIE follow an e-First publication model, with papers published first online and then in print and on CD-ROM. Papers are published as they are submitted and meet publication criteria. A unique, consistent, permanent citation identifier (CID) number is assigned to each article at the time of the first publication. Utilization of CIDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online, print, and electronic versions of the publication. SPIE uses a six-digit CID article numbering system in which:
The CID Number appears on each page of the manuscript. The complete citation is used on the first page, and an abbreviated version on subsequent pages. Numbers in the index correspond to the last two digits of the six-digit CID Number. Conference CommitteesConference Chairs
International Program Committee
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Session Chairs
IntroductionIt is with great pleasure that we present these proceedings from the Eighth International Conference on Thin Film Physics and Applications, held 20-23 September 2013 in Shanghai, China. This conference (TFPA2013) is intended to report on the latest advances and innovations in thin film from growth, characterization, and physics, to the applications and associated devices; as well as serve as a discussion forum for exchanging information about the development, application, and experimental results from thin film systems by bringing together researchers, academics, manufacturers and students working in the field. The event aims to cover the most up-to-date and diverse thin films such as nanostructure films, ferroelectric and piezoelectric films, magnetic films, superconductor films, organic and polymer films, micro/nano-fabrications and characterizations, photonics and MEMS devices, solar cells, and others. The conference was very successful with over 82 contributions (as oral or poster presentations) together with 35 invited talks delivered from authors of diverse international affiliations (e.g. United States, Germany, Japan, China, Korea, Russia, Australia, and others). By organizing TFPA2013, it is our sincere hope to help promote and broaden the diffusion of the research activities in the thin film field. We would like to express our sincere appreciation to the program committee and session chairs, to colleagues who participated in the conference, to the SPIE staff and to all our hosts and meeting sponsors whose contributions were all essential to the success of this conference. Junhao Chu Chunrui Wang |
