24 June 2014 Getting small: new 10μm pixel pitch cooled infrared products
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Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermalimaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Y. Reibel, Y. Reibel, N. Pere-Laperne, N. Pere-Laperne, T. Augey, T. Augey, L. Rubaldo, L. Rubaldo, G. Decaens, G. Decaens, M.-L. Bourqui, M.-L. Bourqui, A. Manissadjian, A. Manissadjian, D. Billon-Lanfrey, D. Billon-Lanfrey, S. Bisotto, S. Bisotto, O. Gravrand, O. Gravrand, G. Destefanis, G. Destefanis, G. Druart, G. Druart, N. Guerineau, N. Guerineau, } "Getting small: new 10μm pixel pitch cooled infrared products", Proc. SPIE 9070, Infrared Technology and Applications XL, 907034 (24 June 2014); doi: 10.1117/12.2051654; https://doi.org/10.1117/12.2051654


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