The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.
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Author(s), “Title of Paper,” in Sensors for Extreme Harsh Environments, edited by Debbie G. Senesky, Sachin Dekate, Proceedings of SPIE Vol. 9113 (SPIE, Bellingham, WA, 2014) Article CID Number.
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Wolfgang Schade, Technische Universität Clausthal (Germany) and Fraunhofer Heinrich-Hertz-Institut (Germany)
Debbie G. Senesky, Stanford University (United States)
Sachin Dekate, GE Global Research (United States)
Conference Program Committee
The inaugural conference on Sensors for Extreme Harsh Environments showcased recent results from members of this unique and emerging community. During this conference, insights on the performance and design considerations of sensor materials, devices and systems within harsh radiation, temperature and chemical environments were presented. In addition, the requirements for implementing these new technologies on actual commercial (automotive and geothermal power) and space/defense platforms (space rovers and hypersonic structures) were highlighted. A roadmap for addressing the challenges of integrating and manufacturing reliable micro- and nano-scale devices for harsh environment sensing applications was discussed. Representation from academia, industry and government agencies provided a comprehensive audience. Also, participants from overseas—Belgium, Austria, Germany and Taiwan—aided in obtaining a global view of the challenges of this field.
We would like to thank our esteemed colleagues for making it an insightful and productive conference. We are thrilled to share your hard work and exciting results through this proceedings volume. We look forward to building upon our initial success at DSS 2015!
Debbie G. Senesky