2 May 2014 Uniform fabrication of thick SU-8 patterns on small-sized wafers for micro-optics applications
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This paper reports on an alternative method for precise and uniform fabrication of 100μm-thick SU-8 microstructures on small-sized or non-circular samples. Standard spin-coating of high-viscosity resists is indeed known to induce large edge beads, leading to an air gap between the mask and the SU-8 photo-resist surface during UV photolithography. This results in a non uniform thickness deposition and in a poor pattern definition. This problem becomes highly critical in the case of small-sized samples. To overcome it, we have developed a soft thermal imprint method based on the use of a nano-imprint equipment and applicable whatever sample fragility, shape and size (from 2cm to 6 inches). After final photolithography, the SU8 pattern thickness variation profile is measured. Thickness uniformity is improved from 30% to 5% with a 5μm maximal deviation to the target value over 2cm-long samples.
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S. Abada, S. Abada, B. Reig, B. Reig, E. Daran, E. Daran, JB Doucet, JB Doucet, T. Camps, T. Camps, S. Charlot, S. Charlot, V. Bardinal, V. Bardinal, "Uniform fabrication of thick SU-8 patterns on small-sized wafers for micro-optics applications", Proc. SPIE 9130, Micro-Optics 2014, 91300R (2 May 2014); doi: 10.1117/12.2052451; https://doi.org/10.1117/12.2052451


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