A comparative study of the thermal interface materials with graphene and boron nitride fillers

F. Kargar; R. Salgado; S. Legedza; J. Renteria; A. A. Balandin

doi:10.1117/12.2070704

10 September 2014 A comparative study of the thermal interface materials with graphene and boron nitride fillers

F. Kargar, R. Salgado, S. Legedza, J. Renteria, A. A. Balandin

Proceedings Volume 9168, Carbon Nanotubes, Graphene, and Associated Devices VII; 91680S (2014) https://doi.org/10.1117/12.2070704
Event: SPIE NanoScience + Engineering, 2014, San Diego, California, United States

Abstract

We report the results of an experimental study that compares the performance of graphene and boron nitride flakes as fillers in the thermal interface materials. The thickness of both fillers varied from a single atomic plane to about a hundred. The measurements have been conducted using a standard TIM tester. Our results show that the addition of a small fraction of graphene (f=4 wt%) to a commercial thermal interface material increases the resulting apparent thermal conductivity substantially stronger than the addition of boron nitride. The obtained data suggest that graphene and fewlayer graphene flakes couple better to the matrix materials than the boron nitride fillers. A combination of both fillers can be used to increase the thermal conductivity while controlling the electrical conduction.

Citation Download Citation

F. Kargar, R. Salgado, S. Legedza, J. Renteria, and A. A. Balandin "A comparative study of the thermal interface materials with graphene and boron nitride fillers", Proc. SPIE 9168, Carbon Nanotubes, Graphene, and Associated Devices VII, 91680S (10 September 2014); https://doi.org/10.1117/12.2070704

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