28 August 2014 Mechanical behavior of microelectromechanical microshutters
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Abstract
A custom micro-mechanical test system was constructed using off-the-shelf components to characterize the mechanical properties of microshutters. Microshutters are rectangular microelectromechanical apertures which open and close about a narrow torsion bar hinge. Displacement measurements were verified using both capacitive and digital image correlation techniques. Repeatable experiments on Si3N4 cantilever beams verified that the test system operates consistently. Using beam theory, the modulus of elasticity of the low stress Si3N4 was approximately 150 GPa, though significant uncertainty exists for this measurement due primarily to imprecise knowledge of the cantilever thickness. Tests conducted on microshutter arrays concluded that reducing the Si3N4 thickness from 250 nm to 500 nm reduces the torsional stiffness by a factor of approximately four. This is in good agreement with analytical and finite element models of the microshutters.
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Devin E. Burns, Devin E. Burns, Justin S. Jones, Justin S. Jones, Mary J. Li, Mary J. Li, } "Mechanical behavior of microelectromechanical microshutters", Proc. SPIE 9170, Nanoengineering: Fabrication, Properties, Optics, and Devices XI, 917009 (28 August 2014); doi: 10.1117/12.2060449; https://doi.org/10.1117/12.2060449
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