This paper will provide an overview of various laser processing techniques used in the fabrication of solar cells. There are numerous applications of lasers including laser doping, annealing, patterning, drilling and welding that vary based on material system (e.g. silicon wafer, polycrystalline thin-film) and the cell architecture. Laser annealing has been identified as a potential route to high quality thin-films for polycrystalline semiconductors such as CdTe and Cu(In,Ga)(Se,S)2. Also for thin-film solar cell technologies, including amorphous-silicon, laser patterning has been widely adopted within the industry for creating monolithic interconnections and performing edge isolation. For silicon wafer based technologies there are a number of promising laser processing techniques, however most of these techniques are still in the development stages and are not yet incorporated into industrial production lines. These techniques that represent the next generation of high-efficiency crystalline silicon devices, include laser-fired contacts, laser doping of selective emitters, laser drilling for “wrap-through” device structures, and laser grooved buried contacts. This paper will present a review of each technique, the specific processing applications and the current state of development.