Ultra-thin wafer-level camera with 720p resolution using micro-optics

Andreas Brückner; Alexander Oberdörster; Jens Dunkel; Andreas Reimann; Martin Müller; Frank Wippermann

doi:10.1117/12.2061006

12 September 2014 Ultra-thin wafer-level camera with 720p resolution using micro-optics

Andreas Brückner; Alexander Oberdörster; Jens Dunkel; Andreas Reimann; Martin Müller; Frank Wippermann

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Proceedings Volume 9193, Novel Optical Systems Design and Optimization XVII; 91930W (2014) https://doi.org/10.1117/12.2061006
Event: SPIE Optical Engineering + Applications, 2014, San Diego, California, United States

Abstract

We propose a microoptical approach to ultra-compact optics for real-time vision systems that are inspired by the compound eyes of insects. The demonstrated module achieves 720p resolution with a total track length of 2.0 mm which is about 1.5 times shorter than comparable conventional miniaturized optics. The partial images that are separately recorded in multiple optical channels are stitched together to form a final image of the whole FOV by means of image processing. The microlens arrays are realized by microoptical fabrication techniques on wafer-level which are suitable for a potential application in high volume e.g. for consumer electronic products.

Citation Download Citation

Andreas Brückner, Andreas Brückner, Alexander Oberdörster, Alexander Oberdörster, Jens Dunkel, Jens Dunkel, Andreas Reimann, Andreas Reimann, Martin Müller, Martin Müller, Frank Wippermann, Frank Wippermann, } "Ultra-thin wafer-level camera with 720p resolution using micro-optics", Proc. SPIE 9193, Novel Optical Systems Design and Optimization XVII, 91930W (12 September 2014); doi: 10.1117/12.2061006; https://doi.org/10.1117/12.2061006

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