5 September 2014 Micro packaging of hermetic seal mini dual in line laser diode module for aerospace applications
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Normally, reliable, reproducible, high-yield packaging technologies are essential for meeting the cost, performance, and service objectives for the harsh environment of space applications. This paper describes a new improved micro packaging method of hermetic seal mini-DIL (dual in line) laser diode module. The problem of using a softer solder resulted in failure mechanisms observed in the mini-DIL laser diode module based laser firing unit (LFU) for ordinance ignition of a missile system. These failures included: (1) failure in light output pulse power, (2) fiber pigtail damage inside the package snout which caused low LFU production yield. Our distinctive challenge for this project is the micro packaging of mini-DIL. For this package a new technique for the hermetic sealing using a micro-soldering process was developed. The process is able to confine the solder seal to a small region inside the snout near the fiber feed-through hole on the wall of the mini-DIL package. After completing the development, which included temperature and thermal cycling, X-rays analysis showed the new method had no fiber damage after the microsoldering seal. The new process resulted in 100% success in the packaging design and was granted a patent for the innovative development.
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Alex A. Kazemi, Alex A. Kazemi, Eric Chan, Eric Chan, Dennis Koshinz, Dennis Koshinz, "Micro packaging of hermetic seal mini dual in line laser diode module for aerospace applications", Proc. SPIE 9202, Photonics Applications for Aviation, Aerospace, Commercial, and Harsh Environments V, 920219 (5 September 2014); doi: 10.1117/12.2061788; https://doi.org/10.1117/12.2061788

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