Technologies For Automated In-Process E-Beam Metrology

Israel Nadler-Niv; Uriel Halavee

doi:10.1117/12.968346

1 January 1988 Technologies For Automated In-Process E-Beam Metrology

Israel Nadler-Niv, Uriel Halavee

Author Affiliations +

Proceedings Volume 0921, Integrated Circuit Metrology, Inspection, and Process Control II; (1988) https://doi.org/10.1117/12.968346
Event: Santa Clara Symposium on Microlithography, 1988, Santa Clara, CA, United States

Abstract

A new wafer metrology system, featuring high throughput, automation, and E-beam accuracy has been developed. Novel technologies were integrated into the system in order to meet the stringent requirements of in-process VLSI critical dimension control.

Citation Download Citation

Israel Nadler-Niv and Uriel Halavee "Technologies For Automated In-Process E-Beam Metrology", Proc. SPIE 0921, Integrated Circuit Metrology, Inspection, and Process Control II, (1 January 1988); https://doi.org/10.1117/12.968346

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