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14 June 1988 Novel Process For Fabricating Low Distortion X-Ray Masks Of Submicron Gold Patterns
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A novel process for fabricating x-ray masks of submicron gold patterns using a copper plating base is presented and discussed in detail. In the E-beam writing of x-ray masks, the trilevel resist layers and the metal layer for x-ray absorber patterning cause a proximity effect which determines the masks' resolution. Based on E-beam simulations and experimental results, copper plating base is selected as the best metal-layer material to reduce the above effect. To fabricate submicron gold patterns on the copper base, two gold-electroplating steps are newly introduced. These are strike plating and pulse-current plating. Stress change in the plated gold and positional accuracy changes are also measured throughout the heating process. Finally, sequential steps for the fabrication of x-ray masks with plating base are shown.
© (1988) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Shinji Kuniyoshi, Akihiko Kishimoto, Taroh Ogawa, Takashi Soga, and Takeshi Kimura "Novel Process For Fabricating Low Distortion X-Ray Masks Of Submicron Gold Patterns", Proc. SPIE 0923, Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII, (14 June 1988); doi: 10.1117/12.945649;


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