Paper
17 October 2014 High-throughput parallel SPM for metrology, defect, and mask inspection
H. Sadeghian, R. W. Herfst, T. C. van den Dool, W. E. Crowcombe, J. Winters, G. F. I. J. Kramer
Author Affiliations +
Proceedings Volume 9231, 30th European Mask and Lithography Conference; 92310B (2014) https://doi.org/10.1117/12.2065939
Event: 30th European Mask and Lithography Conference, 2014, Dresden, Germany
Abstract
Scanning probe microscopy (SPM) is a promising candidate for accurate assessment of metrology and defects on wafers and masks, however it has traditionally been too slow for high-throughput applications, although recent developments have significantly pushed the speed of SPM [1,2]. In this paper we present new results obtained with our previously presented high-throughput parallel SPM system [3,4] that showcase two key advances that are required for a successful deployment of SPM in high-throughput metrology, defect and mask inspection. The first is a very fast (up to 40 lines/s) image acquisition and a comparison of the image quality as function of speed. Secondly, a fast approach method: measurements of the scan-head approaching the sample from 0.2 and 1.0 mm distance in under 1.4 and 6 seconds respectively.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
H. Sadeghian, R. W. Herfst, T. C. van den Dool, W. E. Crowcombe, J. Winters, and G. F. I. J. Kramer "High-throughput parallel SPM for metrology, defect, and mask inspection", Proc. SPIE 9231, 30th European Mask and Lithography Conference, 92310B (17 October 2014); https://doi.org/10.1117/12.2065939
Lens.org Logo
CITATIONS
Cited by 6 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Scanning probe microscopy

Metrology

Photomasks

Defect inspection

Image acquisition

Inspection

Semiconducting wafers

RELATED CONTENT

The use of eDR 71xx for DSA defect review and...
Proceedings of SPIE (March 19 2015)
Learning from native defects on EUV mask blanks
Proceedings of SPIE (July 28 2014)
Multi-beam SEM technology for ultra-high throughput
Proceedings of SPIE (July 09 2015)
Particle Detection By Low Voltage SEM
Proceedings of SPIE (January 01 1988)
Defect inspection strategy of LEEPL masks
Proceedings of SPIE (June 28 2005)

Back to Top