How holistic process control translates into high mix logic fab APC?

B. Le-Gratiet; M. Gatefait; J. Ducotè; J. Decaunes; A. Lam; B. Beraud; M. Mikolajczak; A. Pelletier; B. Orlando; F. Sundermann; A. Ostrovsky; C. Lapeyre

doi:10.1117/12.2064795

17 October 2014 How holistic process control translates into high mix logic fab APC?

B. Le-Gratiet, M. Gatefait, J. Ducotè, J. Decaunes, A. Lam, B. Beraud, M. Mikolajczak, A. Pelletier, B. Orlando, F. Sundermann, A. Ostrovsky, C. Lapeyre

Author Affiliations +

Proceedings Volume 9231, 30th European Mask and Lithography Conference; 92310V (2014) https://doi.org/10.1117/12.2064795
Event: 30th European Mask and Lithography Conference, 2014, Dresden, Germany

Abstract

Advanced CMOS nodes require more and more information to get the wafer process well setup. Process tool intrinsic capabilities are not sufficient to secure specifications. APC systems (Advanced Process Control) are being developed in waferfab to manage process context information to automatically adjust and tune wafer processing. The APC manages today Run to Run component from and between various process steps plus a sub-recipes/profiles corrections management. This paper will outline the architecture of an integrated/holistic process control system for a high mix advanced logic waferfoundry.

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B. Le-Gratiet, M. Gatefait, J. Ducotè, J. Decaunes, A. Lam, B. Beraud, M. Mikolajczak, A. Pelletier, B. Orlando, F. Sundermann, A. Ostrovsky, and C. Lapeyre "How holistic process control translates into high mix logic fab APC?", Proc. SPIE 9231, 30th European Mask and Lithography Conference, 92310V (17 October 2014); https://doi.org/10.1117/12.2064795

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