2 June 2014 Stress and flow analyses of ultraviolet-curable resin during curing
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Proceedings Volume 9234, International Conference on Experimental Mechanics 2013 and Twelfth Asian Conference on Experimental Mechanics; 923408 (2014) https://doi.org/10.1117/12.2053962
Event: International Conference on Experimental Mechanics 2013 and the Twelfth Asian Conference on Experimental Mechanics, 2013, Bangkok, Thailand
Abstract
The stress and flow generated in ultraviolet (UV)-curable resin during curing in molds were measured to investigate their relationship. The specimens were molds consisting of glass plates and acrylic bars, and UV-curable liquid resin. The specimens were illuminated from above with UV rays. Photoelastic and visual images were separately obtained at a constant time interval using cameras during curing. To help obtain the visual images, acrylic powder was mixed with the liquid resin. The stress was obtained from the photoelastic images by a digital photoelastic technique with phase stepping, and the flow was obtained from the visual images by a particle-tracking velocimetry technique. Results indicate that the stress generated in the UV-curable resin during curing depends on the degree of contact between the mold and the cured area of the resin, and is hardly related to the flow.
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Eisaku Umezaki, Akira Okano, Hiroto Koyama, "Stress and flow analyses of ultraviolet-curable resin during curing", Proc. SPIE 9234, International Conference on Experimental Mechanics 2013 and Twelfth Asian Conference on Experimental Mechanics, 923408 (2 June 2014); doi: 10.1117/12.2053962; https://doi.org/10.1117/12.2053962
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